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CVE-2022-22064

HIGH CVSS: 7.5 Published: 2022-06-14 Modified: 2026-06-17

Description

Possible buffer over read due to lack of size validation while unpacking frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Affected Platforms

Qualcomm Sd768GQualcomm Wcn6856Qualcomm Wsa8835Qualcomm Sa8155P FirmwareQualcomm Wsa8830 FirmwareQualcomm Sm7325P FirmwareQualcomm Sd730 FirmwareQualcomm Sd768G FirmwareQualcomm Qcn7605 FirmwareQualcomm Mdm9650 Firmware

Weakness Type

CWE-125

References